Apple's domestic manufacturing initiative involves a collaboration with Samsung on semiconductor production in the United States
Apple, the technology giant, is making a significant shift in its chip production strategy by partnering with Samsung Electronics. This move marks a departure from Apple's reliance on TSMC (Taiwan Semiconductor Manufacturing Company) for the development and production of new chips.
The collaboration between Apple and Samsung is aimed at developing a new, pioneering chip manufacturing technology that has never been used before in the world. This groundbreaking technology will be produced at Samsung's plant in Austin, Texas, and at Samsung's new chip manufacturing facilities, including the resumed construction of Plant 5 at the Pyeongtaek complex in South Korea and advanced chip packaging facilities in the United States.
One of the key benefits of this new technology is its potential to optimize the performance of Apple products, such as iPhones. The specific details of the technology Apple is working on for the production of its chips have not been disclosed yet.
Samsung could also supply the next generation of ISOCELL camera sensors for Apple products, with the production of these sensors taking place in Samsung's plant in Austin, Texas.
Apple's decision to partner with Samsung does not affect the expansion of TSMC's investments in the US. TSMC recently announced plans to expand its total investments in the US to $165 billion.
Interestingly, Apple has no plans to cooperate with Intel for the production of its chips. Instead, Apple is investing $100 billion in the American Manufacturing Program.
It's important to note that Intel has strongly advocated for government support and foundries, but Apple has no immediate plans to collaborate with them.
The new chips developed through this partnership are expected to be delivered worldwide. The exact timeline for the delivery of these chips and the completion of the new chip manufacturing facilities have not been disclosed.
This expansion includes the construction of three new fabs, two advanced packaging facilities, and a research and development center. The new chip technology, once fully developed and implemented, is expected to revolutionize the chip manufacturing industry and set a new standard for performance and efficiency.
