Soaring server CPU power consumption could lead to more complex water cooling systems, such as the one described, becoming commonplace. These intricate water blocks might potentially find their way into gaming PCs as well.
Published on August 28, 2025
As the world of technology continues to evolve, so does the demand for advanced thermal solutions. In a recent article, tech writer Nick Evanson, with a background in physics and IT, discusses the potential application of complex liquid cooling solutions like the diffusion-bonded cold plate for gaming PCs.
Evanson's article highlights the increasing power consumption of processors, with GPUs currently leading the pack. The RTX 5090 GPU, for instance, consumes a significant 575 watts, while AMD's EPYC 9965 processor uses up to 500 watts. With companies like AMD planning to double that figure for their next generation of massively-cored CPUs, it's no wonder that the demand for efficient cooling solutions is on the rise.
One company at the forefront of this development is Alloy Enterprises, who have developed a complex liquid cold plate for Nvidia's H100 AI superchip. This cold plate, constructed from laser-cut layers of aluminium using nTop's modelling software, is bonded together using a process called diffusion-bonding.
Microloops, another company in the industry, anticipates server CPUs to consume 4,000 watts of power by 2034, highlighting the need for such advanced cooling solutions. Ultra-enthusiasts and overclockers may even modify their RTX 5090 GPUs to use over 750 watts of power, further emphasizing the importance of efficient cooling.
Evanson also notes that technologies like vapor chambers, water-cooling, and RGB lighting, once limited to a few, have become more accessible to consumers. This trend suggests that by 2034, consumers might have diffusion-bonding cold plates on their CPUs.
The author, who has worked with MadOnion, Futuremark, and TechSpot.com, is currently obsessed with GPUs and open-world grindy RPGs. His article serves as a fascinating insight into the future of thermal solutions, painting a picture of a world where advanced cooling technologies are no longer a luxury, but a necessity.
The H100 GPU, primarily used for AI training, inference, and large-scale data processing, consumes 700 watts of power. This high power consumption has led to a high demand for such advanced cooling solutions, with companies like Alloy Enterprises and Microloops leading the charge.
As we move towards a future where processors consume more power, it's clear that the need for efficient cooling solutions will only continue to grow. The development of technologies like the diffusion-bonded cold plate is a promising step towards meeting this demand.
